HOOPS 2022 Toolkits Improve Manufacturing and BIM Workflows

New advanced HOOPS technology SDKs from Tech Soft 3D for MCAD and AEC software developers and their innovative applications.

This month, Tech Soft 3D of Bend, Oregon, the leading provider of engineering software development toolkits (SDKs), announced the release of the HOOPS 2022 SDKs.

HOOPS technology

HOOPS technology is a proven technology stack that powers world-class engineering and design software applications across many industries, from manufacturing to architecture and engineering.

The new HOOPS 2022 technology improves animation, data access and exchange, simulation and rendering capabilities. This will help Tech Soft 3D partners and their software solutions to remain competitive in their industry sectors, by providing the leading 3D technologies provided.

HOOPS Visualize 2022 now supports physics-based rendering (PBR) on mobile platforms to generate photorealistic graphics by modeling real-world light behavior.

HOOPS 2022 will help reduce product development time and cost for desktop, web, mobile, and AR/VR application solutions.

“Technology continues to advance at a rapid pace, and our team is laser-focused to ensure our partners have the most advanced, rugged, and high-performance component technologies that will enable them to create the applications they need. they need quickly and easily,” said Eric Vinchon, Vice President of Partner Success at Tech Soft 3D. “Staying ahead of trends and getting to market faster than our competitors is the top priority of our partners, and Tech Soft 3D is the best-in-class engine for 3D graphics, CAD data translation, and 3D data publishing that will enable our partners to deliver these applications.

Apple Silicon support and other new features

Key new features in HOOPS 2022 include:

  • Apple silicon support — Apple’s recent switch from Intel chips to their new ARM-based architecture forces partners to port their apps to deliver the best experience to their users. We now provide an official version of our HOOPS toolkits to enable this process.
  • Animation Manager — New animation features, including a new animation manager, are designed to meet a variety of engineering animation needs, ranging from 5D BIM simulations to Digital Factory animations and work instruction creation.
  • Physical rendering (PBR) — PBR has been added to HOOPS Communicator to provide higher quality rendering for web applications and is now also available in HOOPS Visualize for mobile platforms.
  • Spatial relationships — Support for “spatial relationships” that are part of the IFC (Industry Foundation Class) model definition allows for navigating the model, querying the model in the context of the Quantity Takeoff (QTO) and more.

Additional upgrade SKDs include:

  • HOOPS exchange — Native CAD and standard format support for Inventor 2022, ACIS 2021 1.0 and Parasolid 34.0, as well as constraint access for CATIA V5 files to optimize workflows for manufacturing simulation applications , robotics, kinematic analysis, etc.
  • HOOPS Visualize – New elimination mechanism to eliminate front faces, making it easier for the user to see the insides of objects, which is useful for visualizing analysis results. Android AR Sandbox app refresh and more…
  • HOOPS Communicator – supports assembly-level functionality across various broken workflows, allows users to view all parts or one building or mechanical assembly at once, and easily switch part versions/revisions individual or sub-assemblies without having to reconvert or process the entire set of 3D objects. There are new rendering modes (Sketch Mode and Conceptual Mode) based on standard AEC application interfaces, allowing users to replicate the environment they are used to in AEC workflows.
  • HOOPS Publish — HTML export improvements for quality and fidelity with 3D PDFs

HOOPS Toolkits are also available via the Native HOOPS and Web HOOPS Platforms. HOOPS platforms combine market-leading 3D technologies for CAD data exchange, visualization and publication, as well as tight connections to popular modeling kernels. With one-time licensing fees, these offerings are the most cost-effective way to leverage the full range of HOOPS functionality for existing applications and future development projects.

Developers interested in evaluating HOOPS SDKs can sign up for a free 60-day evaluation. Users can now interact with demos, videos, download a free trial, step-by-step tutorials, read partner testimonials, and browse updated documentation. Learn more by clicking the links below and start a free trial today:

To learn more, visit them online here.

Architosh analysis and commentary

Tech Soft 3D’s technology is not particularly well known in the CAD/BIM world as it lives under the hood of many applications. Software developers don’t tend to tout HOOPS technology by name the way they do with modeling kernels like Parasolid. Maybe that will change at some point in the future. Nevertheless, HOOPS SDKs are used by the MCAD industry and AEC software giants, including companies like Trimble and Bentley.

Apple Silicon’s support this quickly is a nice surprise for sure. Although this support is initially intended to support applications on Apple Mac computers running on Apple’s own M-series SoC semiconductors, it lays the foundation for future professional engineering software on Windows on ARM architecture chips in the near future. We agree with some analysts that NVIDIA’s failed bid to get ARM due to regulatory issues and ARM’s path to a second IPO will ignite a fire under ARM to innovate more aggressively. if he wants to target the data center and remove Intel X86 architecture chips. NVIDIA’s “grace” chips, announced earlier this year, are ARM processors for large-scale AI and HPC. In short, we expect aggressive innovation in the ARM space and we also understand that Microsoft’s push with ARM for Windows will expand, possibly even enabling Windows 11 for ARM on Apple Silicon Macs. And MediaTek, a little-known chip company in the West, apparently wants to get in on the action for Windows on ARM. Where it really matters is on the laptops and tablets being carried into the field for manufacturing and AEC workflows.

HOOPS technology already shines on Apple iOS. So now that some of Apple’s iPad Pros use M (Apple Silicon) chips, it makes perfect sense for HOOPS 2022 to support Apple Silicon.

On some of the technologies in HOOPS 2022. We think the logging features could be really interesting in the AEC context, not just MCAD applications. And the new rendering modes are also a great addition to this 2022 release of HOOPS technology.

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